View BU7294FV_7788539.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 1/27 22.may.2013 rev.001 tsz22111 ? 14? 001 datashee t operational amplifiers series input/output full swing high slew rate low voltage cmos operational amplifiers bu7291g, bu7291sg, bu7294xx, bu7294sxx general description bu7291g/bu7294xx and bu7291sg/bu7294sxx are low supply voltage cmos operational single/quad amplifiers. this series is a input/output full swing, high slew rate, low supply current and high speed operation. input bias current is very low at 1pa (typ) . especially,bu7291sg and bu7294sxx, it has wide temperature range from -40 ? c to +105 ?c. features ? high slew rate ? input/output full swing ? large dc voltage gain ? low input bias current application ? battery equipment ? consumer electronics key specifications ? low operating supply voltage (single supply): +2.4v to +5.5v ? high slew rate: 3.0v/s ? wide temperature range: bu7291g/bu7294xx -40 ?c to +85 ?c bu7291sg/bu7294sxx -40 ?c to +105 ?c ? low input offset current: 1pa (typ) ? low input bias current: 1pa (typ) package w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm sop14 8.70mm x 6.20mm x 1.71mm ssop-b14 5.00 mm x 6.40mm x 1.35mm simplified schematic product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. figure 1. simplified schematic (1 channel only) +in out -in vdd vss vbias class a b control vbias http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 2/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx pin configuration bu7291g, bu7291sg : ssop5 bu7294f, bu7294sf : sop14 BU7294FV, bu7294sfv : ssop-b14 ordering information b u 7 2 9 x x x x - x x part number bu7291g bu7291sg bu7294xx bu7294sxx package g:ssop5 f:sop14 fv:ssop-b14 packaging and forming specification e2: embossed tape and reel (sop14/ ssop-b14) tr: embossed tape and reel (ssop5) pin no. pin name 1 +in 2 vss 3 -in 4 out 5 vdd pin no. pin name 1 out1 2 -in1 3 +in1 4 vdd 5 +in2 6 -in2 7 out2 8 out3 9 -in3 10 +in3 11 vss 12 +in4 13 -in4 14 out4 package ssop5 sop14 ssop-b14 bu7291g bu7291sg bu7294f bu7294sf BU7294FV bu7294sfv 78 6 9 51 0 41 1 31 2 21 3 11 4 ch4 + - ch1 -+ out1 -in1 +in1 vdd out3 +in3 -in3 vss ch2 -+ + - ch3 out4 -in4 +in4 out2 +in2 -in2 3 4 2 1 5 + +in -in vss vdd out http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 3/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx line-up topr package operable part number -40 ?c to +85 ?c ssop5 reel of 3000 bu7291g-tr -40 ?c to +105 ? c ssop5 reel of 3000 bu7291sg-tr -40 ?c to +85 ?c sop14 reel of 2500 bu7294f-e2 -40 ?c to +105 ? c sop14 reel of 2500 bu7294sf-e2 -40 ?c to +85 ?c ssop-b14 reel of 2500 BU7294FV-e2 -40 ?c to +105 ? c ssop-b14 reel of 2500 bu7294sfv-e2 absolute maximum ratings (ta=25 ?c) parameter symbol ratings unit bu7291 bu7294 bu7291s bu7294s supply voltage vdd-vss +7 v power dissipation pd ssop5 0.54 *1*4 w sop14 0.45 *2*4 ssop-b14 0.70 *3*4 differential input voltage *5 vid vdd - vss v input common-mode voltage range vicm (vss - 0.3) to vdd + 0.3 v input current *6 ii 10 ma operating supply voltage vopr +2.4 to +5.5 v operating temperature topr - 40 to +85 - 40 to +105 ?c storage temperature tstg - 55 to +125 ?c maximum junction temperature tjmax +125 ?c note: absolute maximum rating item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 to use at temperature above ta 25? c reduce 5.4mw. *2 to use at temperature above ta 25? c reduce 4.5mw. *3 to use at temperature above ta 25? c reduce 7.0mw. *4 mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). *5 the voltage difference between inverting input and non-inverting input is the differential input voltage. then input pin voltage is set to more than vss. *6 an excessive input current will flow when input voltages of more than vdd+0.6v or lesser than vss-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 4/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx electrical characteristics bu7291, bu7291s (u nless otherwise specified vdd=+3v, vss=0v, ta=25 ? c) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *7 vio 25 ? c - 1 9 mv - input offset current *7 iio 25 ? c - 1 - pa - input bias current *7 ib 25 ? c - 1 - pa - supply current *8 idd 25? c - 470 800 a rl= av=0db, +in=1.5v full range - - 1100 maximum output voltage(high) voh 25 ? c vdd-0.1 - - v rl=10k ? maximum output voltage(low) vol 25 ? c - - vss+0.1 v rl=10k ? large signal voltage gain av 25 ? c 70 105 - db rl=10k ? input common-mode voltage range vicm 25 ? c 0 - 3 v vss to vdd common-mode rejection ratio cmrr 25 ? c 40 60 - db - power supply rejection ratio psrr 25 ? c 45 80 - db - output source current *9 isource 25 ? c 5 8 - ma vdd-0.4v output sink current *9 isink 25 ? c 9 16 - ma vss+0.4v slew rate sr 25 ? c - 3.0 - v/ s cl=25pf gain band width gbw 25 ? c - 2.8 - mhz cl=25pf, f=100khz unity gain frequency f t 25? c - 2.8 - mhz cl=25pf phase margin 25? c - 50 - deg cl=25pf total harmonic distortion +noise thd+n 25 ? c - 0.03 - % out=0.8v p-p , f=1khz *7 absolute value *8 full range bu7291: ta=-40 ? c to +85 ? c bu7291s: ta=-40 ? c to +105 ? c *9 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic. http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 5/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx bu7294, bu7294s (u nless otherwise specified vdd=+3v, vss=0v, ta=25 ? c) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *10 vio 25 ? c - 1 9 mv - input offset current *10 iio 25 ? c - 1 - pa - input bias current *10 ib 25 ? c - 1 - pa - supply current *11 idd 25? c - 2000 3200 a rl= , all op-amps av=0db, +in=1.5v full range - - 4400 maximum output voltage(high) voh 25 ? c vdd-0.1 - - v rl=10k ? maximum output voltage(low) vol 25 ? c - - vss+0.1 v rl=10k ? large signal voltage gain av 25 ? c 70 105 - db rl=10k ? input common-mode voltage range vicm 25 ? c 0 - 3 v vss to vdd common-mode rejection ratio cmrr 25 ? c 40 60 - db - power supply rejection ratio psrr 25 ? c 45 80 - db - output source current *12 isource 25 ? c 5 8 - ma vdd-0.4v output sink current *12 isink 25 ? c 9 16 - ma vss+0.4v slew rate sr 25 ? c - 3.0 - v/ s cl=25pf gain band width gbw 25 ? c - 2.8 - mhz cl=25pf, f=100khz unity gain frequency f t 25? c - 2.8 - mhz cl=25pf phase margin 25? c - 50 - deg cl=25pf total harmonic distortion +noise thd+n 25 ? c - 0.03 - % out=0.8v p-p , f=1khz channel separation cs 25 ? c - 100 - db f=1khz, out=0.5vrms *10 absolute value *11 full range bu7294: ta=-40 ? c to +85 ? c bu7294s: ta=-40 ? c to +105 ? c *12 under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the ou tput current is reduced to clim b to the temperature inside ic. http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 6/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx description of electri cal characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturer?s document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 supply voltage (vdd/vss) indicates the maximum voltage that can be applied between the vdd terminal and vss terminal without deterioration or destruction of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic wi thin the input common-mode voltage range characteristics. 1.4 power dissipation (pd) indicates the power that can be consumed by the ic when mo unted on a specific board at the ambient temperature 25 ? c (normal temperature). as for package product, pd is determi ned by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. 2.2 input offset current (iio) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. 2.4 supply current (idd) indicates the current that flows within the ic under specified no-load conditions. 2.5 maximum output voltage(high) / maximum output voltage(low) (voh/vol) indicates the voltage range of the outpu t under specified load condition. it is typically divided into maximum output voltage high and low. maximum output voltage high indica tes the upper limit of out put voltage. maximum output voltage low indicates the lower limit. 2.6 large signal voltage gain (av) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. av = (output voltage) / (differential input voltage) 2.7 input common-mode voltage range (vicm) indicates the input voltage range where ic normally operates. 2.8 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.9 power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) 2.10 output source current/ output sink current (isource / isink) the maximum current that c an be output from the ic under specific output conditions. the output source current indicates the current flowing out from the ic, and the output sink current indica tes the current flowing into the ic. 2.11 slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied. 2.12 gain band width (gbw) the product of the open-loop voltage gai n and the frequency at which the voltage gain decreases 6db/octave. 2.13 unity gain frequency (f t ) indicates a frequency where the voltage gain of operational amplifier is 1. 2.14 phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. 2.16 total harmonic distortion+noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. 2.12 channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 7/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c 0 200 400 600 800 1000 1200 -50-25 0 255075100125 ambient temperature [c] supply current [ a] 2.4v 5.5v 3.0v figure 5. supply current ? ambient temperature 0 200 400 600 800 1000 1200 23456 supply voltage [v] supply current [ a] -40 ?c 25?c 85?c 105?c figure 4. supply current ? supply voltage figure 2. derating curve 85 bu7291g 105 figure 3. derating curve bu7291sg 0 200 400 600 800 0 255075100 ambient temperature [c] power dissipation [w] . 0 200 400 600 800 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] . 0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 8/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c figure 6. maximum output voltage high ? supply voltage (rl=10k ? ) 0 1 2 3 4 5 6 123456 supply voltage [v] output voltage high [v] -40 ?c 25?c 85?c 105 ?c figure 7. maximum output voltage high ? ambient temperature (rl=10k ? ) 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambien t temper atu r e [c ] output voltage high [v] 5.5v 3.0v 2.4v figure 9. maximum output voltage low ? ambient temperature (rl=10k ? ) figure 8. maximum output voltage low - supply voltage (rl=10k ? ) 0 2 4 6 8 10 23456 supply voltage [v] output voltage low [mv] -40 ?c 25?c 85?c 105 ?c 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 ambient temperature [c] output voltage low [mv] 5.5v 3.0v 2.4v http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 9/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx figure 11. output source current ? ambient temperature (out=vdd-0.4v) typical performance curves - continued bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c figure 10. output source current ? output voltage (vdd=3v) 0 10 20 30 40 50 00.511.522.53 output voltage [v] output source current [ma] -40 ?c 25?c 85?c 105 ?c 0 5 10 15 20 -50-250 255075100125 ambient temperature [c] output source current [ma] 2.4v 5.5v 3.0v figure 12. output sink current ? output voltage (vdd=3v) 0 20 40 60 80 0.00.51.01.52.02.53.0 output voltage [v] output sink current [ma] -40 ?c 25?c 85?c 105 ?c 0 20 40 60 80 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] figure 13. output sink current ? ambient temperature (out=vss+0.4v) 5.5v 2.4v 3.0v http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 10/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c -5 -4 -3 -2 -1 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] figure 14. input offset voltage ? supply voltage (vicm=vdd, out=1.5v) -5 -4 -3 -2 -1 0 1 2 3 4 5 23456 supply voltage [v] input offset voltage [mv] -40 ?c 25?c 85?c 105 ?c -15 -10 -5 0 5 10 15 -101234 c ommon mod e in pu t vol tage [v] input offset voltage [mv] figure 16. input offset voltage ? common mode input voltage (vdd=3v) -40 ?c 25?c 85?c 105 ?c figure 17. large signal voltage gain ? supply voltage 60 80 100 120 140 160 23456 supply voltage [v] large signal voltage gain [db] . -40 ?c 25?c 85?c 105?c figure 15. input offset voltage ? ambient temperature (vicm=vdd, out=1.5v) 5.5v 2.4v 3.0v http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 11/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c 0 20 40 60 80 100 120 23456 supply voltage [v] common mode rejection ratio [db ] -40 ?c 25?c 85?c 105 ?c figure 19. common mode rejection ratio ? supply voltage 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] . 5.5v 2.4v 3.0v figure 18. large signal voltage gain ? ambient temperature 0 20 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 21. power supply rejection ratio ? ambient temperature 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] . 5.5v 2.4v 3.0v figure 20. common mode rejection ratio ? ambient temperature common mode rejection ratio [db] http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 12/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7291, bu7291s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7291g: -40 ? c to +85 ? c bu7291sg: -40 ? c to +105 ? c 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/ s] 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/ s] 5.5v 2.4v 3.0v figure 22. slew rate l-h ? ambient temperature 5.5v 2.4v 3.0v figure 23. slew rate h-l ? ambient temperature 0 20 40 60 80 100 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 frequency [hz] gain[db] 0 50 100 150 200 phase [deg] phase gain figure 24. voltage gain ? phase frequency 10 1 10 2 10 3 10 4 10 5 10 6 10 7 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 13/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294g: -40 ? c to +85 ? c bu7294sg: -40 ? c to +105 ? c 0 1000 2000 3000 4000 5000 -50-25 0 255075100125 ambient temperature [c] supply current [ua] 0 1000 2000 3000 4000 5000 23456 supply voltage [v] supply current [ua] -40 ?c 25?c 85?c 105 ?c figure 27. supply current ? supply voltage 2.4v 5.5v 3.0v figure 28. supply current ? ambient temperature 0 200 400 600 800 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] BU7294FV figure 25. derating curve 85 0 200 400 600 800 0255075100125 ambient temperature [c] power dissipation [w] bu7294sf figure 26. derating curve 105 bu7294f bu7294sfv 0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 14/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294g: -40 ? c to +85 ? c bu7294sg: -40 ? c to +105 ? c 0 1 2 3 4 5 6 23456 supply voltage [v] output voltage high [v] figure 29. maximum output voltage high ? supply voltage (rl=10k ? ) -40 ?c 25?c 85?c 105 ?c 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 ambient temperature [c] output voltage high [v] figure 30. maximum output voltage high ? ambient temperature (rl=10k ? ) 5.5v 3.0v 2.4v 0 1 2 3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 ambient temperature [c] output voltage low [mv] 2.4v 5.5v figure 32. maximum output voltage low ? ambient temperature (rl=10k ? ) 3.0v 0 1 2 3 4 5 6 7 8 9 10 23456 supply voltage [v] output voltage low [mv] -40 ?c 25?c 85?c 105 ?c figure 31. maximum output voltage low ? supply voltage (rl=10k ? ) http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 15/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294: -40 ? c to +85 ? c bu7294s: -40 ? c to +105 ? c 0 10 20 30 40 50 00.511.522.53 ou tpu t vol tage [v] output source current [ma] 0 20 40 60 80 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 20 40 60 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 ou tpu t vol tage [v] output sink current [ma] -40 ?c 25?c 85?c 105 ?c figure 33. output source current ? output voltage (vdd=3v) 2.4v 5.5v 3.0v figure 34. output source current ?ambient temperature (out=vdd-0.4v) -40 ?c 25?c 85? c 105 ?c figure 35. output sink current ? output voltage (vdd=3v) 5.5v 2.4v 3.0v figure 36. output sink current ? ambient temperature (out=vss+0.4v) http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 16/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294: -40 ? c to +85 ? c bu7294s: -40 ? c to +105 ? c -5 -4 -3 -2 -1 0 1 2 3 4 5 -50-25 0 25 50 75100125 ambient temperature [c] input offset voltage [mv] figure 38. input offset voltage ? ambient temperature -5 -4 -3 -2 -1 0 1 2 3 4 5 23456 supply voltage [v] input offset voltage [mv] figure 37. input offset voltage ? supply voltage 25?c -40 ?c 105 ?c 85?c 3.0v 2.4v 5.5v 60 80 100 120 140 160 23456 supply voltage [v] large signal voltage gain [db ] figure 40. large signal voltage gain ? supply voltage -40 ?c 85?c 105?c 25?c figure 39. input offset voltage ? common mode input voltage (vdd=3v) -15 -10 -5 0 5 10 15 -101234 c ommon mod e in pu t vol tage [v] input offset voltage [mv] -40 ?c 25? c 85 ?c 105 ?c large signal voltage gain [ db ] http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 17/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294: -40 ? c to +85 ? c bu7294s: -40 ? c to +105 ? c 0 20 40 60 80 100 120 140 160 -50-25 0 25 50 75100125 ambient temperature [c] large signal voltage gain [db ] 0 20 40 60 80 100 120 23456 su ppl y vol tage [v] common mode rejection ratio [db ] 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db ] -40 ?c 25?c 85?c 105 ?c figure 42. common mode rejection ratio ? supply voltage 5.5v 2.4v 3.0v figure 41. large signal voltage gain ? ambient temperature 0 20 40 60 80 100 120 140 -50-25 0 255075100125 ambient temperature [c] power supply rejection ratio [db] figure 44. power supply rejection ratio ? ambient temperature 5.5v 2.4v 3.0v figure 43. common mode rejection ratio ? ambient temperature large signal voltage gain [ db ] common mode rejection ratio [ db ] common mode rejection ratio [ db ] http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 18/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx typical performance curves - continued bu7294, bu7294s (*)the data above is measurement value of typical sample, it is not guaranteed. bu7294: -40 ? c to +85 ? c bu7294s: -40 ? c to +105 ? c 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/ s] 5.5v 2.4v 3.0v figure 45. slew rate l-h ? ambient temperature 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/ s] 5.5v 2.4v 3.0v figure 46. slew rate h-l ? ambient temperature figure 47. voltage gain ? phase frequency 0 20 40 60 80 100 0 0 1 10 100 1000 10000 frequency [hz] gain[db] 0 50 100 150 200 phase [deg] phase gain 10 1 10 2 10 3 10 4 10 5 10 6 10 7 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 19/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx application information null method condition for test circuit1 vdd, vss, ek, vicm unit:v parameter vf s1 s2 s3 vdd vss ek vicm calculation input offset voltage vf1 on on off 3 0 -1.5 3 1 large signal voltage gain vf2 on on on 3 0 -0.5 1.5 2 vf3 -2.5 common-mode rejection ratio (input common-mode voltage range) vf4 on on off 3 0 -1.5 0 3 vf5 3 power supply rejection ratio vf6 on on off 2.4 0 -1.2 0 4 vf7 5.5 calculation 1. input offset voltage (vio) 2. large signal voltage gain(av) 3. common-mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) vio |vf1| = 1+rf/rs [v] a v |vf2-vf3| = 2 (1+rf/rs) [db] 20log cmrr |vf4 - vf5| = 1.8 (1+rf/rs) [db] 20log psrr |vf6 - vf7| = 3.8 (1+ rf/rs) [db] 20log figure 48. test circuit 1 (one channel only) vdd rf=50k ? ri=10k ? 0.015f rs=50? sw2 rl sw3 500k ? 500k ? 0.01f e k 15v dut vss vrl 50k ? vicm sw1 0.015f ri=10k ? vo vf rs=50? 1000pf 0.1f -15v null http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 20/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx switch condition for test circuit2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage rl=10k ? off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on off on off off on unity gain frequency on off off on on off off off on off off on figure 50. slew rate input output wave figure 51. test circuit 3 (channel separation) figure 49. test circuit 2 vl vl vh vl vh 100out1 out2 input wave t input voltage t v output wave sr= v/ t t output voltage 90% 10% sw3 sw1 sw2 sw9 sw10 sw11 sw8 sw5 sw6 sw7 cl sw12 sw4 r1 1k ? r2 100k ? rl vss vdd=3v vo vin- vin+ vdd vss r2=100k ? r1=1k ? vdd vss out1 =0.5vrms vin out2 cs=20log r2=100k ? r1//r2 r1//r2 r1=1k ? other ch http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 21/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx application example voltage follower inverting amplifier non-inverting amplifier figure 53. inverting amplifier circuit figure 54. non-inverting amplifier circuit for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out-of-phase output volt age is shown in the next expression out=-(r2/r1) ?in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is in-phase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ?in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. figure 52. voltage follower vss out in vdd vss r2 vdd in out r1 voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output im pedance. computation for output voltage (out) is shown below. out=in http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 22/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx 0 200 400 600 800 1000 0255075100 ambient temperature [] power dissipation [w] . 0 200 400 600 800 1000 0 25 50 75 100 125 ambient temperature [] power dissipation [w] . power dissipation power dissipation (total loss) indicates the power that the ic can consume at ta=25 ? c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat gener ated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja? c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 55. (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja), given the ambient temperature (ta), maxi mum junction temperature (tjmax), and power dissipation (pd). ja = (tjmax ta ) / p d ? c/w ????? ( ) the derating curve in figure 55. (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certai n temperatures. this gradient is determined by thermal resistance ( ja), which depends on the chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sa me of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 56. (c) to (d) shows an example of the derating curve for bu7291, bu7291s, bu7294, bu7294s. (*13) (*14) (*15) unit 7.0 5.4 4.5 mw/?c when using the unit above ta=25 ? c, subtract the value above per degree ? c. power dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (cooper foil area below 3%) is mounted figure 55. thermal resistance and derating curve (b) derating curve a mbient temperatu r e ta [ ? c ] chip surface temperature tj[ ? c ] (a) thermal resistance ja=(tjmax-ta)/pd ?c/w 0 a mbient temperature ta [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] pd(max) tj(max) ja2 ja1 ja2 < ja1 power dissipation of ic bu7294sfv (*13) bu7291sg (*14) bu7294sf (*15) BU7294FV (*13) bu7291g (*14) bu7294f (*15) figure 56. derating curve 85 105 0.2 0.4 0.8 0.6 1.0 0.2 0.4 0.8 0.6 1.0 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 23/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx operational notes 1) absolute maximum ratings absolute maximum ratings are the values which indicate t he limits, within which the given voltage range can be safely charged to the terminal. however, it does not guarantee the circuit operation. 2) applied voltage to the input terminal for normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage vdd + 0.3v. then, regardless of power supply vo ltage,vss - 0.3v can be applied to input terminals without deterioration or destruction of its characteristics. 3) power supply (single / dual) the op-amp operates when the voltage supplied is between vdd and vss. therefore, the single supply op-amp ca n be used as dual supply op-amp as well. 4) power dissipation pd using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperat ure. therefore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a suff icient margin in thermal des ign. refer to the thermal derating curves for more information. 5) short-circuit between pins and erroneous mounting be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 6) short-circuit between pins and erroneous mounting operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 7) ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluct uations in the electrical characteristics due to piezo resistance effects. 8) board inspection connecting a capacitor to a pin with low impedance may stre ss the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detaching the jig during the inspection phase, make sure that the power is turned off before inspection and removal. furthermore, please take measures against esd in the assembly process as well as during transportation and storage. 9) output capacitor if a large capacitor is connected between the output pin and vss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the vdd pin or vin pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0.1 f between output pin and vss pin. 10) oscillation by output capacitor please pay attention to the oscillati on by output capacitor and in designing an application of negative feedback loop circuit with these ics. 11) latch up be careful of input voltage that exceed the vdd an d vss. when cmos device have sometimes occur latch up and protect the ic from abnormaly noise. http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 24/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx physical dimensions tape and reel information package name ssop5 http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 25/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx package name sop14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr)) http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 26/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx package name ssop-b14 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin http://
datasheet www.rohm.com tsz02201-0rar1g200390-1-2 ?2013 rohm co., ltd. all rights reserved. 27/27 22.may.2013 rev.001 tsz22111 ? 15? 001 bu7291g, bu7291sg, bu7294xx, bu7294sxx e mie ? 2 b2 e marking diagram product name package type marking bu7291 g ssop5 d1 bu7291s fb bu7294 f sop14 bu7294f fv ssop-b14 7294 bu7294s f sop14 bu7294sf fv ssop-b14 7294s land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop14 1.27 4.60 1.10 0.76 ssop-b14 0.65 4.60 1.20 0.35 revision history date revision changes 22.may.2013 001 new release ssop5(top view) part number marking lot number sop14(top view) part number marking lot number 1pin mark ssop-b14(top view) part number marking lot number 1pin mark ssop5 sop14, ssop-b14 mie e b 2 ? 2 http://
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification http://
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. http://
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. http://

▲Up To Search▲

Price & Availability of BU7294FV

	To Download BU7294FV Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .